Threedimensional Molded Interconnect Devices 3Dmid Materials, Manufacturing, Assembly And Applications For Injection Molded Circuit Carriers

Threedimensional Molded Interconnect Devices 3Dmid Materials, Manufacturing, Assembly And Applications For Injection Molded Circuit Carriers
Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
Nº de Páginas: 356
Encadernação: Capa Dura / Hardback
Tema: Materials science