Benefiting from Thermal and Mechanical Simulation in Micro-electronics - Hardback - 2000

Presents papers from the international conference on this topic, EuroSimE2000. This book discusses thermal and mechanical related problems and challenges in micro-electronics. It is useful for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Year of publication: 2000
Pagination: 192 pages, biography
Format: Hardback
Editor: G.Q Zhang, L.J. Ernst, O.De Saint Leger